Search product


Download Teko

Go to download section

MICRO

Family Rf - Electronic enclosures - Metal

Description

Electrolythic tin-plated steel enclosures for High/Frequency electronic components assembly with a cover that can be soldered on for hermetic sealing. Volume of casing is suitable for easy assembly of professional and High-Technology circuits.

Details

Products

Model L (inch) W (inch) H (inch) Color (Ral) Material MAX PCB L (inch) MAX PCB W (inch) Screws Battery Accessories Drawings Other
433.15 1,988 1,24 0,374  - 
B.S.E. T.55 - - - - PDF
DWG
View
434.15 2,5 1,24 0,374  - 
B.S.E. T.55 - - - - PDF
DWG
View
435.15 1,988 1,732 0,374  - 
B.S.E. T.55 - - - - PDF
DWG
View
436.15 2,5 1,732 0,374  - 
B.S.E. T.55 - - - - PDF
DWG
View
443.15 1,988 1,24 0,512  - 
B.S.E. T.55 - - - - PDF
DWG
View
444.15 2,5 1,24 0,512  - 
B.S.E. T.55 - - - - PDF
DWG
View
445.15 1,988 1,732 0,512  - 
B.S.E. T.55 - - - - PDF
DWG
View
446.15 2,5 1,732 0,512  - 
B.S.E. T.55 - - - - PDF
DWG
View
453.15 1,988 1,24 0,689  - 
B.S.E. T.55 - - - - PDF
DWG
View
454.15 2,5 1,24 0,689  - 
B.S.E. T.55 - - - - PDF
DWG
View
455.15 1,988 1,732 0,689  - 
B.S.E. T.55 - - - - PDF
DWG
View
456.15 2,5 1,732 0,689  - 
B.S.E. T.55 - - - - PDF
DWG
View
12 product families, 151 series. You can't find what you're looking for? Contact us