Home	About Us	Enclosures	Technical	Service Desk	News	Contact

EMI/RFI SHIELDING

EMI DIRECTIVE The EMI pollution problem has become serious enough to attract the attention of government agencies who have set out to establish acceptable limits for the electromagnetic emissions of electronics equipment. The limits are set out in the following international directives: United States 1981 FCC Docket #20780 Germany 1977/8 VDE 0871 VDE 0875 E.C. 89/336/EEC

SHIELDING The most cost effective way to avoid EMI problems is to reduce the problems at the PCB and component level. Sometimes, however, despite the best design practice, a system may be unavoidably noisy or susceptible to exterior signals. In this case we have developed ways of shielding our enclosures in order to attenuate the problem. We offer resin bonded shielding coatings based upon conductive pigments such as Nickel, Copper or Silver. The plastic enclosures are sprayed with the conductive lacquer on the interior surfaces. Shielding is available on all of our plastic enclosures. Should you wish to take advantage of this service, please contact our sales team for a quotation.

SHIELDING PERFORMANCE The most popular and cost effective method of achieving EMC involves the use of electrically conductive, resin bonded shielding coatings. Conductive fillers (graphite, silver, nickel, copper) dispersed in a resin matrix are applied on the plastic enclosure with conventional spray equipment. NICKEL COATING is an industry standard for shielding plastic enclosures of electronics and telecommunications equipment. COPPER COATING is used for higher performance requirements as it has better reflective properties at lower frequencies. SILVER COATING has the highest performance against electromagnetic emissions.

	Home	About Us	Enclosures	Technical	Service Desk	News	Contact
CALL TOLL FREE (800) 965 9872
Legal notice: copyright © 2001-2004 TEKO Enclosures, Inc. USA. All rights reserved. Rev:2004.01.07 Teko is the registered trademark of Teko S.p.A. Italy.